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TB2932HQ 2009-02-02 1 toshiba bi-cmos linear integrated circuit silicon monolithic TB2932HQ maximum power 49 w btl 4-ch audio power ic the TB2932HQ is 4ch audio amplifier for car audio application. this ic can generate high powe r, high quality sound output, p out max = 49 w, using a pure complementary p-ch and n-ch dmos output stage. the built-in self diagnosis function which is included can be controlled via i 2 c bus. in addition, stand-by and mute function, and various protection feature are included. features ? high power output : p out max (1) = 49 w (typ.) (v cc = 15.2 v, f = 1 khz, jeita max, r l = 4 ) : p out max (2) = 43 w (typ.) (v cc = 14.4 v, f = 1 khz, jeita max, r l = 4 ) : p out max (3) = 70 w (typ.) (v cc = 14.4 v, f = 1 khz, jeita max, r l = 2 ) : p out (1) = 27 w (typ.) (v cc = 14.4 v, f = 1 khz, thd = 10%, r l = 4 ) : p out (2) = 23 w (typ.) (v cc = 13.2 v, f = 1 khz, thd = 10%, r l = 4 ) : p out (3) = 45 w (typ.) (v cc = 14.4 v, f = 1 khz, thd = 10%, r l = 2 ) ? low distortion ratio: thd = 0.007% (typ.) (v cc = 13.2 v, f = 1 khz, p out = 5 w, r l = 4 ) ? low noise: v no = 60 vrms (typ.) (v cc = 13.2 v, r g = 0 , bw = 20 hz to 20 khz, r l = 4 ) ? built in stand by & muting function: controlled via i 2 c bus (26/12db) ? built in clipping detection (pin 4) ? built in i 2 c bus for stand-by, mute, voltage gain control, self di agnosis: output short detection, offset detection, tweeter or speaker open detection (pin 22 and 25) ? built-in various protection circuits (note 1, note 2) thermal shut down, over-voltage, out to gnd, out to v cc , out to out short circuit ? operating supply voltage: v cc (opr) = 8 to 18 v (r l = 4 ) v cc (opr) = 8 to 16 v (r l = 2 ) note 1: install the product correctly. otherwise, it may result in break down, damage and/or degradation to the product or equipment. note 2: these protection functions are intended to avoid some output short circuits or other abnormal conditions temporarily. these protect functions do not warr ant to prevent the ic from being damaged. - in case of the product would be operated with exceeded guaranteed operating ranges, these protection features may not operate and some output short ci rcuits may result in the ic being damaged. weight: 7.7 g (typ.)
TB2932HQ 2009-02-02 2 block diagram some of the functional blocks, circuit s, or constants labels in the bloc k diagram may have been omitted or simplified for clarity. 1 10 6 20 9 11 8 7 ripple tab v cc2 v cc1 3900 f 0.1 f in1 0.22 f 10 f out1 ( +) pw-gnd1 out1 ( ?) rl = 4 lf 5 12 2 3 in2 0.22 f out2 ( +) pw-gnd2 out2 ( ?) rl = 4 lr 17 15 18 19 in3 0.22 f out3 ( +) pw-gnd3 out3 ( ?) rl = 4 rf 13 pre-gnd 21 14 24 23 in4 0.22 f out4 ( +) pw-gnd4 out4 ( ?) rl = 4 rr 16 i 2 c bus 22 25 scl sda diagnosis sw 4 lpf 47 k a c-gnd 1 f clip detection/ startup circuit. c1 c1 c1 c1 c4 c5 c3 c2
TB2932HQ 2009-02-02 3 caution and application information (description is made referring only on the single channel.) 1.clip detection the output clip detection terminal, pin 4, has an op en collector output struct ure on chip as shown in figure 3. in the case when the output waveform is c lipping, the clip detection circuit is operated and the npn tr. is turned on. it is possible to improve the audio output quality by controlling the volume and/or tone control circuits through a low pass filter (l.p.f.) smoot hing circuit as shown in figure 1. the sensitivity of the circuit to c lipping level can be selected t.h.d. = 1% or 10% via i 2 c bus. in the event that this function is not used, pin4 should be left open circuit. clip detector 4 l.p.f. smoothing circuit volume control circuit tone control circuit output ac waveform internal detection circuit clip det. 5 v output waveform l.p.f output gnd figure 1 clip detection
TB2932HQ 2009-02-02 4 2. external component values effect component name recommended value purpose lower than recommended value higher than recommended value notes c1 0.22 f to eliminate dc cut-off frequency becomes higher cut-off frequency becomes lower c2 10 f to reduce ripple to determine the time of turn on diag power on/off time and turn on diag cycle shorter power on/off time and turn on diag cycle longer c3 0.1 f to provide sufficient oscillation margin reduces noise and provides sufficient oscillation margin c4 1.0 f common reference voltage for all input pop noise is suppressed when c1: c4 = 1:4. c5 3900 f ripple filter power supply ripple filtering pop noise is concerned with this capacitor. note 3: in case of the recommended value not used. 3.fast mute mode this feature will normally be used to suppress pop noise resulting from v cc transients during engine cranking condition. the fast mute mode can be entered on receipt of a command via i 2 c bus. using the ib2 register and setting to ?one? the bit d6, it is possible to generate a fast i 2 c mute command. if a fast mute command is received, this ic w ill operate and will discharge the built-in capacitor . therefore the pop sound will be reduced compared to the condition when fast mute is not used in the engine cranking condition. 4.ic start up procedure as for this product, to decrease an quiescent current with th e stand-by state, the i 2 c bus communication possible condition and the simple conditio n in case of the turning on exist. please confirm of the request the following contents in the limit of the set design. 1) the hardware stand-by state it doesn't impress the external voltag e (5v / 3.3v) and it says the time when the ripple voltage potential is large to the clipdet terminal (4 pins).in ca se of this condition, it becomes istby=0. 2) the software stand-by state when impressing the external voltage (5v / 3.3v) on the clipdet terminal (4 pins), the internal reference of vdd amplifier starts-up, it becomes i 2 c bus communication will possible condition. in case of this condition, it becomes istby=30ua. 3) the ic operation condition in i 2 c bus command (stby l h), when sending by the write command , the charging by the ripple voltage (terminal) begins after the switchover to the condition of the above 2). when the ripple voltage(terminal) reac hes the value of the wish by this, it becomes an ic operation condition. therefore, before communicating in i 2 c bus, it impresses voltage on the clipdet terminal once and vdd must be started. vdd stands up and after the i 2 c bus communication becomes possible, because this terminal functions as the clipdet terminal, only in ic start-up, it requ ests sequence setting to impress potential. incidentally, because it touches much more by the separa te section about the conduct of the clipdet terminal, . * : add start-up voltage (5.0v / 3.3v) through limitation resistance (10k typ.).
TB2932HQ 2009-02-02 5 5.explanation for self diagnosis via i 2 c bus map slave address bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 details hex 0 write mode 1 read mode 1 1 0 1 1 0 0 ? d8h write ? sub address bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 details hex 0 page mode (auto increment) off 1 page mode (auto increment) on ? 0 0 0 0 0 0 1 control byte1 01h ? 0 0 0 0 0 1 0 control byte2 02h ? control byte1 (01h) bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 function 0 0 0 0 0 0 0 1 clip det 1% to 10% change 0 0 0 0 0 0 1 0 rch muting off (play) 0 0 0 0 0 1 0 0 fch muting off (play) 0 0 0 0 1 0 0 0 rch gain 26db to 12db 0 0 0 1 0 0 0 0 fch gain 26db to 12db 0 0 1 0 0 0 0 0 offset det enable 0 1 0 0 0 0 0 0 diag cycle enable 1 ? ? ? ? ? ? ? turn-on select (normal/repeatedly) ? control byte2 (02h) bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 function 0 0 0 0 0 0 0 1 rare short det 0 0 0 0 0 0 1 0 soft mute delay time (40ms/20ms) 0 0 0 0 0 1 0 0 current detection enable 0 0 0 0 1 0 0 0 line drive diag 0 0 0 1 0 0 0 0 stand by off (play) 0 0 1 0 0 0 0 0 clip det pin change to offset det ? 1 ? ? ? ? ? ? fast mute on/off 1 0 0 0 0 0 0 0 current detection. level change from 500 ma (max) to 300 ma (max) note 4: self mute circuit is included on chip and is in independent from i 2 c bus stage. self mute operating voltage is v cc = 7.6 v(rise),7.3v(falls) note 5: auto increment is available. if control byte 1 is chosen by sub address, it is not necessary to send byte 2 in cases when both byte 1 and 2 are to be written. ex) in case of sub address = byte1 chosen: sub address byte 1 byte 1 writing sub address byte 2 byte 2 writing: available sub address byte 1 byte 1 writing ---------------------------- byte 2 writing: available
TB2932HQ 2009-02-02 6 read byte 1 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 at ?bit = 1? condition 0 0 0 0 0 0 0 1 ch1 short to gnd 0 0 0 0 0 0 1 0 ch1 short to v cc 0 0 0 0 0 1 0 0 ch1 open load or offset detected 0 0 0 0 1 0 0 0 ch1 short load 0 0 0 1 0 0 0 0 ch1 diagnosis condition (bit = 1: permanent, 0: turn-on) 0 0 1 0 0 0 0 0 ch1 current detection (at ib2 d2 = 1 = enable only) (ib2 ? d7 = 0: bit = 1: < 250 ma, 0: >500 ma) (ib2 ? d7 = 1: bit = 1: < 100 ma, 0: >300 ma) 0 1 0 0 0 0 0 0 bit = 1: diag. cycle terminated, 0: not terminated 1 0 0 0 0 0 0 0 tsd mute on (thermal warning) byte 2 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 at ?bit = 1? condition 0 0 0 0 0 0 0 1 ch2 short to gnd 0 0 0 0 0 0 1 0 ch2 short to v cc 0 0 0 0 0 1 0 0 ch2 open load or offset detected 0 0 0 0 1 0 0 0 ch2 short load 0 0 0 1 0 0 0 0 ch2 diagnosis condition (bit = 1: permanent, 0: turn-on) 0 0 1 0 0 0 0 0 ch2 current detection (at ib2 d2 = 1 = enable only) (ib2 ? d7 = 0: bit = 1: < 250 ma, 0: >500 ma) (ib2 ? d7 = 1: bit = 1: < 100 ma, 0: >300 ma) 0 1 0 0 0 0 0 0 current sensor activated (d6 = 1) 1 0 0 0 0 0 0 ? offset detection activated (d7 = 1) byte 3 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 at ?bit = 1? condition 0 0 0 0 0 0 0 1 ch3 short to gnd 0 0 0 0 0 0 1 0 ch3 short to v cc 0 0 0 0 0 1 0 0 ch3 open load or offset detected 0 0 0 0 1 0 0 0 ch3 short load 0 0 0 1 0 0 0 0 ch3 diagnosis condition (bit = 1: permanent, 0: turn-on) 0 0 1 0 0 0 0 0 ch3 current detection (at ib2 d2 = 1 = enable only) (ib2 ? d7 = 0: bit = 1: < 250 ma, 0: >500 ma) (ib2 ? d7 = 1: bit = 1: < 100 ma, 0: >300 ma) ? 1 ? ? ? ? ? ? diagnotic status ( = ib1 ? d6 bit = 1: diag enable) 1 ? ? ? ? ? ? ? stand-by status ( = ib2 ? d4 bit = 1: play)
TB2932HQ 2009-02-02 7 byte 4 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 at ?bit = 1? condition 0 0 0 0 0 0 0 1 ch4 short to gnd 0 0 0 0 0 0 1 0 ch4 2 short to vcc 0 0 0 0 0 1 0 0 ch4 open load or offset detected 0 0 0 0 1 0 0 0 ch4 short load 0 0 0 1 0 0 0 0 ch4 diagnosis condition (bit = 1: permanent, 0: turn-on) 0 0 1 0 0 0 0 0 ch4 current detection (at ib2 d2 = 1 = enable only) (ib2 ? d7 = 0: bit = 1: < 250 ma, 0: >500 ma) (ib2 ? d7 = 1: bit = 1: < 100 ma, 0: >300 ma) 0 1 0 0 0 0 0 0 rare short 1 0 0 0 0 0 0 0 ldt det note 6: short circuit protection can be operated channel by channel. ex) if channel 1 output is shorted, channel 1 is protected but other channels are available. caution: sub address 0x15 (15h) is for our internal testing only. do not apply for your using.
TB2932HQ 2009-02-02 8 description for turn on diagnosis this ic can determine whether the conditio ns listed below occur or not at turn on: -short to gnd -short to v cc -output to output short -speaker open as first ?switch on?, the write data is sent to ?turn on? the ic. if the turn on diagnostic is activated at this time , the write data, with the diagnostic cycle byte: ib1 d6 set at 1, is sent at the same time the result of self diagnosis can be obtained from the read data sent after the turn on diagnostic data permitted time, as below figure3: turn on diagnostic acquisition time (80 ms typ.) turn on diagnostic data permitted time read data write data permanent diagnostic enable read data fault event permanent diagnostic data permitted time pin10 ripple voltage figure 2 diagnosis timing chart pin10 ripple voltage turn on diagnostic acquisition time (80 ms typ.) read data turn on diagnostic between on and off time (100 ms typ.) write data set the diagnostic l write data to become standby off (turning or power on) read data figure 3 number of times turn on diagnosis timing chart
TB2932HQ 2009-02-02 9 as initially, the write data is set when the on diagnostic cycle enable (ib1 d6 = 1), the turn on diagnosis can be available for repeated use by sending the read command repeatedly after the initial set up as shown as figure 5. therefore, it is useful to check number of cy cles from power on to the output appearance. this ic has two built-in diagnostic modes dependent on the turn-on timing. a) normal mode (one shot) of turn-on diagnostics (data of ib1, d7 = 0 ) b) repeatability mode of turn-on diagnostics (data of ib1, d7 = 1 ) a) normal mode (one shot diag.) for example, if you want to get two valid readings, you have to send the command to read three times. true data are second data and third data. the data just received was detected on the previous diagnostic cycle. this is trigger to enable the diag cycle. diag cycle with turn-on when ?diag enable? goes high, ?latch? is reflected at the ?fault event?. for example short load, open load etc. i 2 c command pin 10 reading 1 reading 2 reading 3 a bout 100 m diag enable fault event latch db1 d6 you have to read for an interval of 150 ms or more to get a valid reading. writing (diag cycle enable = 1) (stand by off = 0)
TB2932HQ 2009-02-02 10 b) repetition mode the turn on diagnostic acquisition time is dete rmined by the ripple filt er capacitance c2 and the equivalent internal resist ance rr as below expression. acquisition time = 2 c2 rr = 4400 c2 (typ.) rr is fixed in internal circuit and it is no t varied by the fluctuation of power supply v cc voltage. c2 value determines the time from power on (s tandby off) to the appearance of sound signal from output and the characteristic for ripple rejection ratio, too. so, take care with the decision on c2 value. if the turn on diagnosis is not used, in other wo rds the diagnostic cycle defeat command is sent, the waveform of ripple terminal voltage will change but the time from turning on to the output signal appearance will not change as illustrated below in figure4. figure 4 turn on diagnosis timing chart when turn on diagnosis not used. write data pin10 ripple pin voltage turn on diagnosis enable turn on diagnosis defeat i 2 c command pin 10 writing (diag cycle enable = 1) (stand by off = 0) reading 2 reading 3 about 100 ms diag enable fault event latch db1 d6 (acquisition time with only turn-on) reading 4 reading 5 reading 6 about 80 ms maximum interval: you can select the acquisition time. minimum interval: it is determined by the speed of microcomputer. about 80 ms reading 1
TB2932HQ 2009-02-02 11 description for permanent diagnosis this ic can provide permanent diagnosis under the following conditions, whether they occur before or after turning on: -short to gnd -short to vcc -output to output short circuit -output offset detection -current detection for tweeter open this permanent diagnosis is available not only with the diagnostic cycle byte: ib1 d6 set at 1 but also when set at 0. additionally, the signal can be obtained by enteri ng just a read command. it is not necessary to write the data. with permanent diagnosis fault detection, the firs t read data after fault removal will still show a fault. therefore, it is necessary to obtain 3 or more readings in order to prevent a miss judgment. for example, the speaker sometimes makes a large co unter electro motive force which this ic could recognize as a fault event. additionally, this permanent diagnosis is automati cally on after the turnin g on diagnosis operation finished therefore there is no n eed to send the extra command. figure 5 permanent diagnosis timing chart for each short detection turn on diagnostic acquisition time (80 ms typ.) turn on diagnostic data permitted time read data write data read data result faulty fault event pin10 ripple voltage read data result not faulty fault removed read data result faulty permanent diagnostic data permitted time
TB2932HQ 2009-02-02 12 regarding operation of the output offset detection, the software always de tects the output offset but the result is not latched intern ally as shown in the figure below: however, this detection has to be performed in real time: time voltage offset (tvos) between read and next read is set at tvos = 1/the lowest signal frequency ,or more. for instance tvos > 50 ms if the lowest output signal frequency is 20 hz, and to ob tain 2 or more readings in order not to make a misjudgment additionaly, the threshold level is designed at + / ? 2 v. figure 6 software output of fset detection timing chart turn on diagnostic acquisition time (80 ms typ.) turn on diagnostic data permitted time write data read data result faulty fault event pin10 ripple voltage read data result not faulty fault removed permanent diagnostic data permitted time read data result not faulty correct tvos correct tvos
TB2932HQ 2009-02-02 13 the output from the terminal of pin 4 can be changed from clip detector to offset detector output by sending the write command via i 2 c. if the l.p.f output voltage has become a half of pu ll up voltage for a while, firstly the signal output volume goes down (cliping detector function). afte r that, it can be judged that the abnormal output offset has occurred, if the l.p.f. output voltag e does not rise above half of pull up voltage. offset detector 4 l.p.f. smoothing circuit volume control circuit system shut down figure 7 hardware out put offset detection vth vth output waveform offset detector output pin 4 waveform l.p.f output abnormal offset occured volume down judgement waiting time for prevention misjudgement detection delay time
TB2932HQ 2009-02-02 14 when the current detector for tweeter open check is used, it is neccesary to take care as below: - need to input the pulse or signal which is th e higher out of audience frequency for example f = 20 khz - the pulse or signal input timing has to be after mute off (play mode) - at least, the read timing has to be after 1 cycle of input pulse or signal and more, the recommadation cycles are 3 cycle and more if can. - the level of input pulse or signal is more than the detection threshold level 300 ma or 500 ma. for instance, if the tweeter impedance is 20 at f = 20 khz which is same as input signal frequency, the output minimum voltage is: vout = 500 ma 20 = 10 v and more. finally, if db1 d7 = 1 then the temperature of ic chip is close to the thermal shutdown point. this warning bit becomes high, about 10 degrees below the temperature at which the overtemperature prot ection operates. note 7: timing charts may have been simplified for ease of reading. note 8: please arrange to read all self-diagnosis functions twice or more and apply judgment in order to avoid false triggering. figure 8 tweeter open detection timing chart write data mute off read data invalidity read data validity read data invalidity read data validity write data stand by off mute on read data invalidity current detector is not effective effective play mute mute on output
TB2932HQ 2009-02-02 15 multiple faults the self diagnosis shows as below tables when there are multi fault connection for the audio outputs. at turning on: s.gnd (out+ ) s.gnd (out ? ) s.v cc out to out. s open l s.gnd (out + ) s.gnd s.gnd svcc+s.load s.gnd s.gnd + no open s.gnd (out ? ) s.gnd s.load s.gnd s.gnd + no open s.v cc s.v cc s.v cc s.v cc + s.load + open or no open out to out.s s.load s.load + no open open l open at permanent: s.gnd (out+ ) s.gnd (out ? ) s.v cc out to out. s open l s.gnd (out + ) s.gnd s.gnd s.load or s.v cc (note 10) s.gnd s.gnd (note 9) s.gnd (out? ) s.gnd s.gnd or s.v cc (note 10) s.gnd s.gnd (note 9) s.v cc s.v cc s.v cc s.v cc (note 9) out to out.s s.load + s.gnd n/a open l normal note 9: if the dc offset detection mode is on, the information which the dc offset is appeared is added. note10: the chance which they can read this exact info rmation is only one time although in case of other diagnosis, the more times sending read comm and, the higher the conf idence of the result. for example, a) ch1+ is connected to gnd b) ch1 ? is connected to v cc c) they can read or get the ?short to gnd? information when the up send the read command. d) next, however, they can not get the ?short to gnd? or ?short to v cc ? information when the up send the read command again. note 11: please arrange to read all self-diagnosis functions twice or more and apply judgment in order to avoid false triggering. explanation of i 2 c bus commands below the ?address byte?, presently the address byte is fixed at 216 dec = d8hex = 101100xbin. - address selection is d8hexa: a7 address bit 1 a6 address bit 1 a5 address bit 0 a4 address bit 1 a3 address bit 1 a2 address bit 0 a1 address bit 0 a0 (r/w) read/write bit x x: 0 = write instruction to device; 1 = read instruction to device
TB2932HQ 2009-02-02 16 - if r/w = 0, the up sends two instruction bytes, ib1 and ib2: ib1 instruction byte: bit d7 turn-on diag timing normal (d7 = 0) repeat (d7 =1 ) d6 diagnostic cycle enable (d6 = 1) diagnostic cycle defeat (d6 = 0) d5 offset detection enable (d5 = 1) offset detection defeat (d5 = 0) d4 front channel gain = 26db (d4 = 0) gain = 12db (d4 = 1) d3 rear channel gain = 26db (d3 = 0) gain = 12db (d3 = 1) d2 mute front channels (d2 = 0) unmute front channels (d2 = 1) d1 mute rear channels (d1 = 0) unmute rear channels (d1 = 1) d0 cd 1% (d0 = 0) cd 10% (d0 = 1) ib2 instruction byte: bit d7 current det 500 ma (max) (d7 = 0) current det 300 ma (max) (d7 = 1) d6 fast mute on (d6 = 1) off (d6 = 0) d5 pin4 clip detection (d5 = 0) pin4 offset detection (d5 = 1) d4 std-by on-pa not working (d4 = 0) std-by off-pa working (d4 = 1) d3 amplifier mode diagnostic (d3 = 0) line driver mode diagnostic (d3 = 1) d2 current det. diag enabled (d2 = 1) current det. diag defeat (d2 = 0) d1 software mute on and off delay time select work standard 40ms delay (d1 = 0) work standard 20ms delay (d1 = 1) d0 rare short detection harf-short diag defeat (d1 = 0) harf-short diag enable (d1 = 1)
TB2932HQ 2009-02-02 17 - if r/w = 1, the power amplifier sends four diagnostics bytes, db1, db2, db3 and db4: db1 diagnostic byte: bit d7 thermal warning active (d7 = 1) d6 diag not actived or not terminated (d6 = 0) diag terminated (d6 = 1) d5 channel 1 current detection output peak current < 250 ma (ib2 ? d7 = 0) ? open load (d5 = 1) output peak current < 100 ma (ib2 ? d7 = 1) ? open load (d5 = 1) output peak current > 500 ma (ib2 ? d7 = 0) ? normal load (d5 = 0) output peak current > 300 ma (ib2 ? d7 = 1) ? normal load (d5 = 0) d4 channel 1 turn-on diagnostic (d4 = 0) permanent diagnostic (d4 = 1) d3 channel 1 normal load (d3 = 0) short load (d3 = 1) d2 channel 1 turn-on diag: no open load (d2 = 0) open load detected (d2 = 1) offset diag: no output offset (d2 = 0) output offset detected (d2 = 1) d1 channel 1 no short to v cc (d1 = 0) short to v cc (d1 = 1) d0 channel 1 no short to gnd (d0 = 0) short to gnd (d0 = 1)
TB2932HQ 2009-02-02 18 db2 diagnostic byte: bit d7 offset detection not activated (d7 = 0) offset detection activated (d7 = 1) d6 current sensor not activated (d6 = 0) current sensor activated (d6 = 1) d5 channel 2 current detection output peak current < 250 ma (ib2 ? d7 = 0) ? open load (d5 = 1) output peak current < 100 ma (ib2 ? d7 = 1) ? open load (d5 = 1) output peak current > 500 ma (ib2 ? d7 = 0) ? normal load (d5 = 0) output peak current > 300 ma (ib2 ? d7 = 1) ? normal load (d5 = 0) d4 channel 2 turn-on diagnostic (d4 = 0) permanent diagnostic (d4 = 1) d3 channel 2 normal load (d3 = 0) short load (d3 = 1) d2 channel 2 turn-on diag: no open load (d2 = 0) open load detected (d2 = 1) offset diag: no output offset (d2 = 0) output offset detected (d2 = 1) d1 channel 2 no short to v cc (d1 = 0) short to v cc (d1 = 1) d0 channel 2 no short to gnd (d0 = 0) short to gnd (d0 = 1) note 12: dbx (d5) is effective only at the time of ?current detection enable?.
TB2932HQ 2009-02-02 19 db3 diagnostic byte: bit d7 stand-by status ( = ib2 ? d4) d6 diagnostic status ( = ib1 ? d6) d5 channel 3 current detection output peak current < 250 ma (ib2 ? d7 = 0) ? open load (d5 = 1) output peak current < 100 ma (ib2 ? d7 = 1) ? open load (d5 = 1) output peak current > 500 ma (ib2 ? d7 = 0) ? normal load (d5 = 0) output peak current > 300 ma (ib2 ? d7 = 1) ? normal load (d5 = 0) d4 channel 3 turn-on diagnostic (d4 = 0) permanent diagnostic (d4 = 1) d3 channel 3 normal load (d3 = 0) short load (d3 = 1) d2 channel 3 turn-on diag: no open load (d2 = 0) open load detected (d2 = 1) offset diag: no output offset (d2 = 0) output offset detected (d2 = 1) d1 channel 3 no short to v cc (d1 = 0) short to v cc (d1 = 1) d0 channel 3 no short to gnd (d0 = 0) short to gnd (d0 = 1)
TB2932HQ 2009-02-02 20 db4 diagnostic byte: bit d7 lad dump voltage detection enabl e (d7=1) diseble(d6=0) d6 rare short detection enable (d 6=1) diseble (d6=0) d5 channel 4 current detection output peak current < 250 ma (ib2 ? d7 = 0) ? open load (d5 = 1) output peak current < 100 ma (ib2 ? d7 = 1) ? open load (d5 = 1) output peak current > 500 ma (ib2 ? d7 = 0) ? normal load (d5 = 0) output peak current > 300 ma (ib2 ? d7 = 1) ? normal load (d5 = 0) d4 channel 4 turn-on diagnostic (d4 = 0) permanent diagnostic (d4 = 1) d3 channel 4 normal load (d3 = 0) short load (d3 = 1) d2 channel 4 turn-on diag: no open load (d2 = 0) open load detected (d2 = 1) offset diag: no output offset (d2 = 0) output offset detected (d2 = 1) d1 channel 4 no short to v cc (d1 = 0) short to v cc (d1 = 1) d0 channel 4 no short to gnd (d0 = 0) short to gnd (d0 = 1) note 13: dbx (d5) is effective only at the time of ?current detection enable?.
TB2932HQ 2009-02-02 21 examples of bytes sequence 1 - turn-on diagnostic - write operation start address byte with d0 = 0 ack sub-address d0 = 1 ack ib with d6 = 1 ack ib2 ack stop note 14: auto increment 2 - turn-on diagnostic - read operation start address byte with d0 = 1 ack db1 ack db2 ack db3 ack db4 ack stop 3a - turn-on of the power amplifier with 26db gain, mute on, diagnostic defeat. start address byte with d0 = 0 ack sub-address d0 = 1 ack ib 1 ack ib2 ack stop x0x0000x xxx1x0xx note 15: auto increment 3b - turn-off of the power amplifier start address byte with d0 = 0 ack sub-address d0 = 1 ack ib 1 ack ib2 ack stop x0xxxxxx xxx0xxxx note 16: auto increment 4 - offset detection procedure enable start address byte with d0 = 0 ack sub-address d0 = 1 ack ib 1 ack ib2 ack stop xx1xx11x xxx1x0xx note 17: auto increment 5 - offset detection procedure stop and reading operation (the results are valid only for the offset detection bits (d2 of the bytes db1, db2, db3, db4) . start address byte with d0 = 1 ack db1 ack db2 ack db3 ack db4 ack stop
TB2932HQ 2009-02-02 22 i 2 c bus control format outline data transmission format note 18: it is transmitting, without forgetting. p conditions. (1) start conditions & stop conditions (2) bit transmission (3) acknowledgement a7 a6 a5 a4 a3 a2 a1 a0 r/ w 1 1 0 1 1 0 0 x s slave address 0 a sub address a data a p msb 7 bit msb 8 bit msb 8 bit s: start conditions p: stop conditions a : acknowledgement scl s sda p start conditions sto p conditions sda can not be changed sda can be chan g ed sda scl high impedance s 9 high impedance 8 1 sda from a maste r scl from a maste r start conditions
TB2932HQ 2009-02-02 23 TB2932HQ i 2 c bus transmission format (1) write mode in addition to usual transmission, it correspon ds to continuation transmission and the auto increment mode as a transmission format. after a tr ansmission end, in case data transmission is newly, it is necessary to open the term beyond 1 clock. 1) continuation transmission (an address to change is specified. at this time, msb of a sub-address is set as 0.) 2) auto increment (sub address are set to increment from n one by one. msb of a sub-address is set as 1.) read mode the slave address became the read mode by changing the 8 bit of the slave address from 0 to 1. the data output from TB2932HQ starts after the micro controller receives the ack 1 bit which follows a slave address. stop condition are shown in the under the map. the micro controller shall send the stop condition p after it sent the reversed acknowledge (high) in case of the read mode finished. the data transmission became not available condit ion if the micro controller intended to send the stop condition p expect for this procedure because this ic occu pies the data bus until the micro controller send the start conditions again. s slave add 0 a sub add a a data 7 to 0 a sub add b a data 7 to 0 a sub add x a data 7 to 0 p s slave add (r) a data1 a data2 a data3 a data4 a p ........send a data from microcontroller. ........send a data from TB2932HQ. data 7 to 0 p (sub add n + m) s slave add 0 a (sub add n)&80h a data 7 to 0 a data 7 to 0 a data 7 to 0 a (sub add n + 1) (sub add n + 2)
TB2932HQ 2009-02-02 24 absolute maximum ratings (ta = 25c) characteristics symbol rating unit peak supply voltage (0.2 s) v cc (surge) 50 v dc supply voltage v cc (dc) 28 v operation supply voltage v cc (opr) 18 v output current (peak) i o (peak) 9 a power dissipation p d (note 19) 125 w operation temperature t opr ? 40 to 85 c storage temperature t stg ? 55 to 150 c note 19: package thermal resistance j-t = 1c/w (typ.) (ta = 25c, with infinite heat sink) the absolute maximum ratings of a semiconductor device ar e a set of specified parameter values, which must not be exceeded during operation, even for an instant. if any of these rating wo uld be exceeded during operation, the device electrical characteristics may be irreparably altered and the reliability and lifetime of the device can no longer be guaranteed. moreover, these operations with exceeded ratings may cause break down, damage and/or degradation to any other equipment. applications using th e device should be designed such that each maximum rating will never be exceeded in any operating conditions. be fore using, creating and/or producing designs, refer to and comply with the precautions and cond itions set forth in this documents.
TB2932HQ 2009-02-02 25 electrical characteristics (unless otherwise specified, v cc = 13.2 v, f = 1 khz, r l = 4 , ta = 25c) characteristics symbol test circuit test condition min typ. max unit quiescent current i ccq ? v in = 0 ? 160 320 ma p out max (1) ? v cc = 15.2 v, max power ? 49 ? p out max (2) ? v cc = 14.4 v, max power ? 43 ? p out (1) ? v cc = 14.4 v, thd = 10% 24 27 ? output power p out (2) ? thd = 10% ? 23 ? w p out max (3) ? v cc = 14.4 v, max power ? 70 ? p out max (4) ? v cc = 13.7 v, max power ? 64 ? p out (3) ? v cc = 14.4 v, thd = 10% 42 45 ? output power (rl = 2 ) p out (4) ? thd = 10% ? 39 ? w thd (1) ? p out = 5 w ? 0.007 0.1 total harmonic distortion thd (2) ? v o = 2vrms , gv=12db ? 0.005 0.1 % g v (1) ? v out = 0.775 vrms 25 26 27 voltage gain g v (2) ? v out = 0.775 vrms, gv=12db 11 12 13 db voltage gain ratio g v ? v out = 0.775 vrms ? 1.0 0 1.0 db v no (1) ? rg = 0 , din45405 ? 70 ? v no (2) ? rg = 0 , bw = 20 hz~20 khz ? 60 100 output noise voltage v no (3) ? rg = 0 , bw = 20 hz~20 khz gv=12db ? 12 30 vrms ripple rejection ratio r.r. ? f rip = 100 hz, r g = 620 v rip = 0.775 vrms 50 65 ? db cross talk c.t. ? r g = 620 v out = 0.775 vrms ? 70 ? db output offset voltage v offset ? ? ? 100 0 100 mv input resistance r in ? ? ? 90 ? k standby current isb1 ? stand-by condition by bus(vth=low) ? 0.01 1 a vst h ? for operation 2.4 ? v cc start-up controlled voltage (pin4) vst l ? for stby, pin10=0v 0 ? 0.9 v mute attenuation att m ? mute: on v out = 7.75 vrms mute: off 80 90 ? db cd (1) ? low (01h d = 0) ? 1 2.5 clip det thd level cd (2) ? high (01h d = 1) 5 10 15 % note 20: isb specification will be decided to after final evaluation on tolerance spls.
TB2932HQ 2009-02-02 26 diagnosis/bus specification characteristics test condition min typ. max unit turn on diagnosis (power amplifier mode) short to gnd det. under stand-by condition ? ? 1.2 v short to v cc det. v cc ? 1.2 ? ? v shorted load ? ? 0.5 open load 95 ? ? normal load 1.5 ? 45 turn on diagnosis (line driver mode) short to gnd det. under stand-by condition ? ? 1.2 v short to v cc det. v cc ? 1.2 ? ? v shorted load ? ? 2 open load 370 ? ? normal load 6 ? 180 permanent diagnosis (power amplifier and line driver mode) short to gnd det. power amplifier in mute or play ? ? 1.2 v short to v cc det. v cc ? 1.2 ? ? v shorted load power amp mode only ? 0.5 ? offset detection power amplifier in play (no signal) ? + / ? 2 ? v current detector threshold 1 250 500 ma current detector threshold 2 100 300 ma i 2 c bus interface clock frequency ? 400 ? khz
TB2932HQ 2009-02-02 27 test circuit components in the test circuits are on ly used to obtain and confirm the devi ce characteristics. these components and circuits do not warrant to prevent the app lication equipment from malfunction or failure. 1 10 6 20 9 11 8 7 ripple tab v cc2 v cc1 3900 f 0.1 f in1 0.22 f 10 f out1 ( + ) pw-gnd1 out1 ( ? ) rl = 4 lf 5 12 2 3 in2 0.22 f out2 ( + ) pw-gnd2 out2 ( ? ) rl = 4 lr 17 15 18 19 in3 0.22 f out3 ( + ) pw-gnd3 out3 ( ? ) rl = 4 rf 13 pre-gnd 21 14 24 23 in4 0.22 f out4 ( + ) pw-gnd4 out4 ( ? ) rl = 4 rr 16 i 2 c bus 22 25 scl sda diagnosis sw 4 lpf 47 k a c-gnd 1 f clip detection/ startup circuit. c2 c1 c1 c1 c1 c4 c5 c3
TB2932HQ 2009-02-02 28 output power p out (w) thd ? p out (ch1) total harmonic distortion thd (%) output power p out (w) output power p out (w) output power p out (w) thd ? p out (ch2) total harmonic distortion thd (%) thd ? p out (ch4) total harmonic distortion thd (%) thd ? p out (ch3) total harmonic distortion thd (%) 0.1 100 0.001 0.3 1 30 0.5 10 3 5 50 0.01 0.1 0.003 0.005 0.03 0.05 1 0.3 0.5 10 30 100 50 3 5 g v = 26db r l = 4 filter 100 hz : to 30 khz 1 khz : 400 hz to 30 khz 10 khz : 400 hz to 20 khz : 400 hz to f = 1 khz 100 hz 10 khz 20 khz 0.1 100 0.001 0.3 1 30 0.5 10 3 5 50 0.01 0.1 0.003 0.005 0.03 0.05 1 0.3 0.5 10 30 100 50 3 5 v cc = 13.2 v r l = 4 y ch filter 100 hz : ~300 khz 1khz : 400 hz~30 khz 10 khz : 400 hz~ 30 khz : 400 hz~ 0.1 100 0.001 0.3 1 30 0.5 10 3 5 50 0.01 0.1 0.003 0.005 0.03 0.05 1 0.3 0.5 10 30 100 50 3 5 g v = 26db r l = 4 filter 100 hz : to 30 khz 1 khz : 400 hz to 30 khz 10 khz : 400 hz to 20 khz : 400 hz to f = 1 khz 100 hz 10 khz 20 khz 0.1 100 0.001 0.3 1 30 0.5 10 3 5 50 0.01 0.1 0.003 0.005 0.03 0.05 1 0.3 0.5 10 30 100 50 3 5 g v = 26db r l = 4 filter 100 hz : to 30 khz 1 khz : 400 hz to 30 khz 10 khz : 400 hz to 20 khz : 400 hz to f = 1 khz 100 hz 10 khz 20 khz 0.1 100 0.001 0.3 1 30 0.5 10 3 5 50 0.01 0.1 0.003 0.005 0.03 0.05 1 0.3 0.5 10 30 100 50 3 5 g v = 26db r l = 4 filter 100 hz : to 30 khz 1 khz : 400 hz to 30 khz 10 khz : 400 hz to 20 khz : 400 hz to f = 1 khz 100 hz 10 khz 20 khz
TB2932HQ 2009-02-02 29 output power p out (w) thd ? p out (ch1) total harmonic distortion thd (%) output power p out (w) output power p out (w) output power p out (w) thd ? p out (ch2) total harmonic distortion thd (%) thd ? p out (ch4) total harmonic distortion thd (%) thd ? p out (ch3) total harmonic distortion thd (%) 0.01 10 0.001 0.03 0.1 3 1 0.3 0.01 0.1 0.003 0.005 0.03 0.05 1 0.3 0.5 10 30 100 50 3 5 g v = 26db r l = 4 f = 1 khz filter 400 hz to 30 khz 30 100 v cc = 9.0 v 13.2 v 16.0 v 0.01 10 0.001 0.03 0.1 3 1 0.3 0.01 0.1 0.003 0.005 0.03 0.05 1 0.3 0.5 10 30 100 50 3 5 g v = 26db r l = 4 f = 1 khz filter 400 hz to 30 khz 30 100 v cc = 9.0 v 13.2 v 16.0 v 0.01 10 0.001 0.03 0.1 3 1 0.3 0.01 0.1 0.003 0.005 0.03 0.05 1 0.3 0.5 10 30 100 50 3 5 g v = 26db r l = 4 f = 1 khz filter 400 hz to 30 khz 30 100 v cc = 9.0 v 13.2 v 16.0 v 0.01 10 0.001 0.03 0.1 3 1 0.3 0.01 0.1 0.003 0.005 0.03 0.05 1 0.3 0.5 10 30 100 50 3 5 g v = 26db r l = 4 f = 1 khz filter 400 hz to 30 khz 30 100 v cc = 9.0 v 13.2 v 16.0 v
TB2932HQ 2009-02-02 30 frequency f (khz) muteatt ? f mute attenuation muteatt (db) frequency f (khz) r.r. ? f ripple rejection ratio r.r. (db) frequency f (khz) g v ? f voltage gain g v (db) v cc = 13.2 v r l = 4 r g = 620 vrip = 0.775 vrms (0dbm) g v = 26db 0.1 0.01 100 ? 80 1 10 ? 60 ? 40 ? 20 0 3ch 2ch 4ch 1ch total harmonic distortion thd (%) frequency f (khz) thd ? f frequency f (khz) r.r. ? f ripple rejection ratio r.r. (db) v cc = 13.2 v r l = 4 r g = 620 vrip = 0.775 vrms (0dbm) g v = 12db 0.1 0.01 100 ? 80 1 10 ? 60 ? 40 ? 20 0 2ch 3ch 4ch 1ch v cc = 13.2 v r l = 4 v out = 0.775 vrms (0dbm) 0.1 0.01 100 20 1 10 22 24 26 28 1ch to 4ch v cc = 13.2 v r l = 4 p out = 5 w no filter 0.1 0.01 100 0.001 1 10 0.003 0.01 0.03 0.1 0.3 1 3 9 v 18 v 13.2 v v cc = 13.2 v r l = 4 v out = 7.75 vrms (20dbm) 0.1 0.01 100 ? 120 1 10 ? 100 ? 80 ? 60 ? 40 ? 20 0 1ch to 4ch
TB2932HQ 2009-02-02 31 quiescent current i ccq (ma) output power p out (w) input voltage v in (vrms) v in ? p out (ch1) output power p out (w) input voltage v in (vrms) v in ? p out (ch2) output power p out (w) input voltage v in (vrms) v in ? p out (ch3) output power p out (w) input voltage v in (vrms) v in ? p out (ch4) supply voltage v cc (v) i ccq ?v cc ambient temperature ta (c) p d max ? ta allowable power dissipation p d max (w) (1) (2) (3) 25 0 150 0 120 75 60 100 40 20 80 100 50 125 (1) infinite heat sink r jc = 1 c/w (2) heat sink (r hs = 3.5 c/w) r jc + r hs = 4.5 c/w (3) no heat sink r ja = 39 c/w 60 50 40 30 20 10 0 0 2 4 6 8 10 v cc = 13.2 v r l = 4 no filter 100 hz 10 khz f = 20 khz 1 khz 60 50 40 30 20 10 0 0 2 4 6 8 10 v cc = 13.2 v r l = 4 no filter 100 hz 10 khz f = 20 khz 1 khz 60 50 40 30 20 10 0 0 2 4 6 8 10 v cc = 13.2 v r l = 4 no filter 100 hz 10 khz f = 20 khz 1 khz 60 50 40 30 20 10 0 0 2 4 6 8 10 v cc = 13.2 v r l = 4 no filter 100 hz 10 khz f = 20 khz 1 khz 150 0 0 5 10 15 25 30 20 50 100 200 250 v in = 0 r l =
TB2932HQ 2009-02-02 32 cross talk c.t. (db) frequency f (khz) c.t. ? f (ch1) cross talk c.t. (db) frequency f (khz) c.t. ? f (ch2) cross talk c.t. (db) frequency f (khz) c.t. ? f (ch3) cross talk c.t. (db) frequency f (khz) c.t. ? f (ch4) signal source resistance r g ( ) v no ? r g output power p out (w) p d ? p out power dissipation p d (w) output noise voltage v no ( vrms) v cc = 13.2 v r l = 4 f = 1 khz filter to 20 khz 100 10 100 k 0 1 k 10 k 100 200 300 1ch to 4ch 0 0 5 10 15 25 20 20 40 60 80 f = 1 khz r l = 4 4ch drive 9.0 v 13.2 v 16 v 18 v 0.1 0.01 100 ? 80 1 10 ? 60 ? 40 ? 20 0 v cc = 13.2 v r l = 4 f = 1 khz v out = 0.775 vrms (0dbm) r g = 620 ? 100 2ch 3ch 4ch 0.1 0.01 100 ? 80 1 10 ? 60 ? 40 ? 20 0 v cc = 13.2 v r l = 4 f = 1 khz v out = 0.775 vrms (0dbm) r g = 620 ? 100 3ch 1ch 4ch 0.1 0.01 100 ? 80 1 10 ? 60 ? 40 ? 20 0 v cc = 13.2 v r l = 4 f = 1 khz v out = 0.775 vrms (0dbm) r g = 620 ? 100 3ch 2ch 4ch 0.1 0.01 100 ? 80 1 10 ? 60 ? 40 ? 20 0 v cc = 13.2 v r l = 4 f = 1 khz v out = 0.775 vrms (0dbm) r g = 620 ? 100 3ch 1ch 2ch
TB2932HQ 2009-02-02 33 output power p out (w) thd ? p out (ch1) total harmonic distortion thd (%) output power p out (w) output power p out (w) output power p out (w) thd ? p out (ch2) total harmonic distortion thd (%) thd ? p out (ch4) total harmonic distortion thd (%) thd ? p out (ch3) total harmonic distortion thd (%) 0.01 10 0.001 0.03 0.1 3 1 0.3 0.01 0.1 0.003 0.005 0.03 0.05 1 0.3 0.5 10 30 100 50 3 5 g v = 26db r l = 2 f = 1 khz filter 400 hz to 30 khz 30 100 v cc = 9.0 v 13.2 v 16.0 v 0.01 10 0.001 0.03 0.1 3 1 0.3 0.01 0.1 0.003 0.005 0.03 0.05 1 0.3 0.5 10 30 100 50 3 5 g v = 26db r l = 2 f = 1 khz filter 400 hz to 30 khz 30 100 v cc = 9.0 v 13.2 v 16.0 v 0.01 10 0.001 0.03 0.1 3 1 0.3 0.01 0.1 0.003 0.005 0.03 0.05 1 0.3 0.5 10 30 100 50 3 5 g v = 26db r l = 2 f = 1 khz filter 400 hz to 30 khz 30 100 v cc = 9.0 v 13.2 v 16.0 v 0.01 10 0.001 0.03 0.1 3 1 0.3 0.01 0.1 0.003 0.005 0.03 0.05 1 0.3 0.5 10 30 100 50 3 5 g v = 26db r l = 2 f = 1 khz filter 400 hz to 30 khz 30 100 v cc = 9.0 v 13.2 v 16.0 v
TB2932HQ 2009-02-02 34 output power p out (w) p d ? p out power dissipation p d (w) 0 0 5 10 15 25 20 20 60 80 100 f = 1 khz r l = 2 4ch drive 9.0 v 13.2 v 16 v 40
TB2932HQ 2009-02-02 35 package dimensions weight: 7.7 g (typ.)
TB2932HQ 2009-02-02 36 ? use an appropriate power supply fuse to ensure that a lar ge current does not continuously flow in case of over current and/or ic failure. the ic will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and t he breakdown can lead smoke or ignition. to minimize the effects of the flow of a large current in case of breakdown, appropriate settings , such as fuse capacity, fusing time and insertion circuit location, are required. ? if your design includes an inductive load such as a moto r coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power on or the negative current resulting from the back electromotive force at powe r off. for details on how to connect a protection circuit such as a current lim iting resistor or back electromotive forc e adsorption diode, refer to individual ic datasheets or the ic databook. ic breakdown may cause injury, smoke or ignition. ? use a stable power supply with ics with built-in protection functions. if the power supply is unstable, the protection function may not operate, causing ic breakdown. ic breakdown may cause injury, smoke or ignition. ? carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, powe r amp and regulator. if there is a lar ge amount of leakage current such as input or negative feedback condenser, the ic output dc voltage will increase. if this output voltage is connected to a speaker with low input withstand voltage, overcurrent or ic failure can cause smoke or ignition. (the over current can cause smoke or ignition from the ic itself.) in particular, please pay attention when using a bridge tied load (btl) connection type ic that inputs output dc voltage to a speaker directly. ? over current protection circuit over current protection circuits (referred to as current limiter circuits) do not necessarily protect ics under all circumstances. if the over current protec tion circuits operate against the over cu rrent, clear the over current status immediately. depending on the method of use and us age conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or ic break down before operation. in addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the ic may generat e heat resulting in breakdown. ? thermal shutdown circuit thermal shutdown circuits do not necessarily protect ic s under all circumstances. if the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. depending on the method of use and usage conditions, such as exceeding absolute ma ximum ratings can cause the thermal shutdown circuit to not operate properly or ic breakdown before operation. ? heat radiation design when using an ic with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperat ure (tj) at any time and condition. these ics generate heat even during norma l use. an inadequate ic heat radiat ion design can lead to decrease in ic life, deterioration of ic characte ristics or ic breakdown. in addition, please design the device taking into considerate the effect of ic heat r adiation with peripheral components. ? installation to heat sink please install the power ic to the heat sink not to apply excessive mechanical stress to the ic. excessive mechanical stress can lead to package cra cks, resulting in a reduction in reli ability or breakdown of internal ic chip. in addition, depending on the ic, the use of silic on rubber may be prohibited. check whether the use of silicon rubber is prohibited for the ic you intend to use, or not. for details of power ic heat radiation design and heat sink installation, refer to individual technical datasheets or ic databooks. about solderability, following conditions were confirmed ? solderability (1) use of sn-37pb solder bath solder bath temperature = 23 0c dipping time = 5 seconds the number of times = once use of r-type flux (2) use of sn-3.0ag-0 .5cu solder bath solder bath temperature = 245c dipping time = 5 seconds the number of times = once
TB2932HQ 2009-02-02 37 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality a nd reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situat ions in which a malfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before creating and producing des igns and using, customers mus t also refer to and comply with (a) the latest versions of all re levant toshiba information, including without limitation, this d ocument, the specifications, the data sheets and applic ation notes for product and the precautions and conditions set forth in the ?tosh iba semiconductor reliability h andbook? and (b) the instructions for the applicati on that product will be used with or for. custome rs are solely responsible for all aspects of t heir own product design or applications, incl uding but not limited to (a) determining th e appropriateness of the use of this product in such design or applications; (b) evaluating and det ermining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specific applications as expressl y stated in this document. product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety devices, elevat ors and escalators, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? 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